See the revolution in PIC edge-coupling at wafer-scale
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This short video demonstrates how EXFO provides the industry’s only industrial solution for edge-coupling at wafer-scale by uniquely providing multiport testing using a plane of incidence parallel to circuit plane, essential for true industrial scalability. The Test Plan Execution is shown while performing automatic edge-coupled wafer testing using EXFO’s industry-leading OPAL-EC probe station and PILOT software. The Results Manager application is also explored.
