Automated wafer-level testing of photonic integrated circuits
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How can you make wafer testing faster, more scalable and more reliable to ultimately improve time-to-market? Top manufacturers of Silicon Photonics and other integrated optical components pooled efforts for an integrated and automated way to test photonic integrated circuits (PICs). EXFO’s test experts collaborated with SiPh pioneers from Hewlett Packard Enterprise (HPE) and probe station innovators from MPI Corporation to jointly tackle the challenges faced during wafer-level optical testing.
